Product · HVAC & Energy
Product · Assessment pending · Claimed, not yet evidenced
Coolant channels etched directly into the silicon die; up to 3x better heat removal than cold plates, 65% GPU temperature drop.
Coolant channels etched directly into the silicon die; up to 3x better heat removal than cold plates, 65% GPU temperature drop. Moves the cooling boundary inside the chip, the step beyond direct-to-chip. Who: Microsoft Research + Corintis. Status: Lab demonstration, roadmap item mid-2026.
#liquid-cooling #next-gen